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Doha

    Semiconductor Assembler C - Doha, دولة قطر - Boeing

    Boeing
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    وصف
    • Wafer Handling; Size: 100mm,150mm, 200mm. Type: Germanium, GaAs, Silicone,InP
    • Performs the processes necessary for thefabrication and production of Solar Cells, includingPhotolithography, Cap Etch/Window Clean, Thinning, Lift-Off,Evaporation, Sinter, Saw-Dice, Lot Code, electrical testing,microscope inspection and SiliconDiodes.
    • Performs the processes necessary forgrowth of semiconductors, including operation of MOCVD vacuumsystem, Metal Organic material handling and X-RayDiffraction.

  • Boeing

    Semiconductor Assembler C

    منذ 6 أيام


    Boeing Doha, دولة قطر

    Wafer Handling; Size: 100mm, 150mm, 200mm. Type: Germanium, GaAs, Silicone, InP · Performs the processes necessary for the fabrication and production of Solar Cells, including Photolithography, Cap Etch/Window Clean, Thinning, Lift-Off, Evaporation, Sinter, Saw-Dice, Lot Code, el ...